Projects

Theme details
Click on theme title for full details, abreviations are shown in brackets and used in projects table to indicate primary, secondary and tertiary fit to themes.
Manufacturing Business Processes (MBP)
Sustainable Manufacture, Products and Processes (SMPP) Design for X (DfX)
Challenging Environments: New Application Areas(CE:NAA) Materials, Manufacturing Processes & Technology (MMP&T)
 


Flagship Projects
Contact
Themes addressed
Industrial Engagement
 
Publications
 
Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE)

Uni. of Oxford
Dr H Assender

MMP&T

 

 

Axess Technologies Ltd, General Vacuum Equipment, Camvac Ltd, Dalmatian Technology, DuPont Teijin Films Ltd, Nampak Healthcare
Parkside, Proctor and Gamble, Scott Bader, Silvaco Europe Ltd

 click here
Smart Microsystems

Edinburgh Uni.
Prof A Walton
Heriot-Watt Uni.
Prof M Desmulliez

MMP&T

 

 

National Semiconductor, Memsstar (Point 35 Microstructures), Qinetiq, ST Microelectronics, SELEX Galileo, Wolfson Microelectronics,
MicroStencil, Ceimig, Semefab, Pyreos, Renishaw

 click here
Optical Printed Circuit Board Manufacturing

Loughborough Uni. Dr D Hutt
Heriot-Watt Uni.
Prof A Walker

MMP&T

DfX

CE:NAA

Xyratex, Exxelis Ltd., Renishaw, Cadence Design Systems Ltd, BAE Systems, Merlin Circuit Tech Ltd, Rsoft design UK Ltd, Xaar

click here

Power Electronics

Greenwich Uni.
Prof C Bailey

DfX

MMP&T

CE:NAA

Morgan Technical Ceramics, Dynex, Semelab Plc, TRW Automotive, Goodrich, International Rectifier, RSL Power and Control, Rolls-Royce, QinetiQ, BAE Systems, Switched Reluctance Drives Ltd

 click here
 


Standard Projects

Contact
Themes addressed
Industrial Engagement
 
Publications
 
3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed MEMS components

Loughborough Uni.
Prof P Conway
Uni. of Leeds
Prof I Robertson
Imperial College London
Dr S Lucyszyn

MMP&T    

EADS Astrium Ltd, antenova, e2v technologies, Ultra Electronics, Plextek

 click here
Costing for Avionic Through Life Availability (CATA)

 Loughborough Uni.
Dr M Goh
Uni. of Bath
Dr L Newnes
Uni. of West of England
Dr G Parry
MBP    

GE Aviation, Calce, de&s (MOD), BAE systems, Georgia Tech, IDMRC, University of the West of England BSS

 click here
Design for Increased Yield for the Electronics Manufacturing Supply Chain (DIY)

 Loughborough Uni.
Prof A West		 MBP    

STI, GE, Accelonix, TWI, Selex, Invotec Group Ltd, AEC

  
Development and Manufacture of Electronic Devices Based on Novel Electrofunctional Plastics

 Uni. of Surrey
Dr C Lekakou		 Broadening and deepening award QinetiQ, BAE Systems, Hydrogen Solar, Dow Corning S.A click here
High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communications

 Loughborough Uni.
Prof J Vardaxoglou		 DfX    

Sarbe (Signature Industries), Advanced Therapeutic Materials, Antrum

 click here
High-performance low-cost power modules for energy smart network applications

 Nottingham Uni.
Prof Mark Johnson
 SMPP    

Dynex Semiconductor, Areva, CRDM

 click here
Micro-interconnects Using Mono-sized Polymer Microspheres for Large Format High Resolution Sensor Packaging

 Loughborough Uni.
Prof C Liu		 MMP&T    

Rutherford AppLeton Laboratory, Conpart, NPL

 click here
Sustainable Ultrasonic Electroless & Immersion Plating Processes for Photovoltaic & PCB Manufacture

 Uni. of Coventry
Dr A Cobley		 SMPP    

Chestech Ltd, Universite de Franche-Compte, SP Technical Research Institute of Sweden, NaREC, LSA, Kelan  Cicuits Ltd, The Institute of Metal Finishing, Institute of Circuit Technology, Whitfield Solar

 click here
Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging

 Imperial College London
Dr A Holmes		 MMP&T    

GE Aviation, SONY, Finetech

 click here
WHISKERMIT: Manufacturing and in-service tin whisker mitigation strategies for high value electronics

 Loughborough University
Dr Geoff Wilcox		 CE:NAA    

Rolls-Royce, NPL, MBDA Missile Systems, MacDermid Industrial Solutions, Gen3 Systems, Aero engine Controls

 click here
A Prognostic and Diagnostic Environment for High Reliability Electronic Systems

Nottingham Uni. Prof Mark Johnson

 DfX CE:NAA MMP&T

Micro Circuit Engineering, Flomerics, Dynex, Rolls-Royce, Smiths

 click here
International secondment support: Cost Estimating for Low Volume Long Life Products in Electronic Defence Systems: CALCE visit Greenwich Uni.
Prof C Bailey		 International Secondment   click here
Design and Simulation of Complex Low Volume Electronics Production

 Loughborough Uni.
Prof A West		 MBP DfX  

Goodrich, Smith Aerospace Ltd, Surface Technology International Ltd, Accelonix Ltd, Datalink Electronics Ltd, Custom Intyerconnect Ltd (CIL)

 click here
Design for Manufacture Methodology for System in Package Technology

Lancaster Uni.
Prof A Richardson

 DfX CE:NAA MBP

Flomerics, Conventor, Selex, Philips

 click here
Frequency Agile Microwave Bonding System (FAMOBS)

Heriot-Watt Uni.
Prof M Desmulliez

 MMP&T DfX

Bookham, NPL, Micro Circuit Engineering, Renishaw, Henkel

 click here
Fullerene Chemically Amplified Resists for Next Generation Lithography Birmingham University
Dr A Robinson		 Broadening and Deepening

Sincrotrone Trieste, Tokyo Ohka Kogyo Co. Ltd, Intel

 click here
Glass Substrates for High Density Electrical and Optical Interconnect

 Loughborough Uni. Dr David Hutt MMP&T SMPP DfX

Thales, Micro Circuit Engineering, Rohm and Haas, Circatex

 click here
Integrated Health Monitoring of MNT Enabled Integrated Systems

Lancaster Uni.
Prof A RichardsonHeriot Watt Uni. Dr C Wang

 DfX CE:NAA MMP&T

MicroCircuit Engineering, QinetiQ, Conventor, Philips Semiconductors

 click here
Nanoparticle Stabilized Solder Materials for High Reliability Applications

Kings College London
Prof S Mannan

 MMP&T CE:NAA SMPP

NPL, Sondex Wireline Ltd, Henkel

 click here
Novel high energy density, high reliability capacitors

 University of Oxford
Professor P Grant		 MMP&T CE:NAA DfX

Norfolk Capacitors Ltd, Rolls-Royce Plc, Nanion, Scott Bader

 click here
The Evaluation of Sonochemical Techniques for Sustainable Surface Modification in Electronic Manufacturing

Coventry Uni.
Prof T Mason

 MMP&T SMPP MBP

UK Displays and Lighting KTN, Chestech Ltd, Moulded Circuits Ltd, Prosonix Ltd, National Industrial Symbiosis Programme (NISP), Surface Engineering Association, Conpart, Kings College London, Technic UK

  
The Use of Advanced Sensing Technologies for Protection Suits-enabling Safer Safety Critical Manned Missions

Coventry Uni.
Dr E Gaura

 CE:NAA DfX  

NP Aerospace, BAE Systems

 click here
Thin-film deposition and laser patterning for high volume manufacture of electrical structures

 Brunel Uni.
(Dr B Ramsey)		 MMP&T SMPP DfX

DuPont Teijin Films, Ultimet Films, Cressington Sci Instruments Ltd, Exitech Advanced Laser Technology, Blue Ventures

 click here
Through Life cost estimating within defence systems

 Uni. of Bath
Dr L Newnes		 MBP DfX  

Defence Procurement Agency MOD, Smiths Aerospace, E-IMRC

 click here
Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) Nottingham Uni. Prof Mark Johnson      

Dynex Semiconductor Ltd, TT-electronics Semelab, Alstom Grid, Converteam UK Ltd

  
Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing Uni. of Coventry
Dr A Cobley		      

Intrinsiq Materials Ltd, Printed Electronics Ltd, Graphic Circuits Ltd, Chestech Ltd, The Institute of Circuit Technology

  
Conductive Resists for Nanofabrication on Insulating Substrates Birmingham University
Dr A Robinson		      

IQE Europe, RFMD (UK), Precision Micro, Vistec, EM Systems Support/Raith GmbH, Chestech, Oxford Instruments PLC, INEX

  
Sustaining Electronic Industry Through Managing Uncertainty in Contract Bidding Uni. of Bath
Dr L Newnes		      

BAE Systems Surface Ships Integrated Support Limited, Rolls Royce Submarines, Corporate BAE Systems (AUS), BAE Systems Military Air Information (MAI)

  
Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces Uni. of Southampton
Prof J McBride
      

Micro-Materials Ltd., National Physical Laboratory, TaiCaan Technologies Ltd, C-MAC Ltd

  
 

Feasibility Studies
Contact
Themes addressed
Industrial Engagement
 
Publications
 

Electrochemically assisted integration of organic semiconductors on CMOS and MEMS

Uni. of Strathclyde
Prof D Uttamchandani

MMP&T

 

 

Semefab (Scotland) Ltd, Scottish Microelectronics Centre Institute of Integrated Micro and Nano Systems

  

Challenges for electronic manufacturing posed by new surface contamination failure modes in the context of the wireless revolution

Loughborough Uni.
Mr D Whalley

CE:NAA

MMP&T

MBP

 Henkel Technologies, Circatex click here

Chemically Amplified Molecular Resists for Electron Beam Lithography

Uni. of Birmingham
Dr A Robinson

MMP&T

SMPP

 

Mapper Lithography, Rohm and Haas, Intel Corporation

 click here

Design Tools for the Manufacture and Implementation of Pb-Free Solder joints: Materials Modelling Challenges

 Loughborough Uni.
Dr R Thomson

DfX

SMPP

MMP&T

 National Physical Laboratory  

Development and manufacture of transparent, electrically conductive, flexible plastics

Uni. of Surrey
Dr C Lekakou

MMP&T

DfX

 

QinetiQ, BAE Systems, Hydrogen Solar, Dow Corning S.A

 click here

FAMOBS: Frequency agile microwave open-oven bonding system

Heriot-Watt Uni.
Prof M Desmulliez

MMP&T

 

 

 Bookham, NPL, Micro Circuit Engineering, Renishaw, Henkel click here

Lithographically Printed Integrated Electronics

 Brunel Uni.
Dr D Southee

MMP&T

SMPP

DfX

Gwent Electonic Materials, DuPont Teijin Films, DuPont Teijin Films, Parlex Europe, Hallmark Cards, Arjowiggins, Poly-Flex Circuits

 Click here

Lithographically Printed Voltaic Cells

 Brunel Uni.
Dr D Southee

SMPP

MMP&T

MBP

Arjowiggins, Rohm and Haas Electronic Materials, DuPont Teijin Films

 click here

Manufacturing Electronic Devices Using Embossing & Microcontact Printing

 Brunel Uni.
Dr P Evans

MMP&T

SMPP

DfX

Gwent Electronic Materials, ArjoWiggins Fine Papers Ltd

 click here
Microemulsion Fabrication of Nanoparticles for Enhanced Solder Materials

Kings College London
Prof S Mannan

 

 MMP&T     Henkel click here

Micro-Materials Integration & Evolution in Digital Electronics Manufacturing

 Loughborough Uni.
Prof C Liu

MMP&T

SMPP

 

Rohm and Haas, Xaar Plc

 click here

Scoping study of laser patterning of thin-films for high volume manufacture of electrical structures

Uni. of Hull
Dr H Snelling

MMP&T

SMPP

DfX

Cressington, Adcal, DuPont Teijin Films, Teer Coatings Ltd, Blue Ventures

 click here

Scoping Study: The Rapid Assessment of Electronic Product Enclosure Plastics for Manufacturing Support and End-of-Life Management

Uni. of Surrey
(Prof G Stevens)

SMPP

MMP&T

 

 Intellect  
 


Studentships
Contact
Themes addressed
Industrial Engagement
 
Publications
 
Development of high performance permalloy cored inductors for integration with IC technology

 Uni. of Edinburgh
Prof Walton		          
Electroprinting & Electrospinning of electrically conductive, transparent, flexible plastic nanocomposites

 Uni. of Surrey
Dr C Lekakou		          
Fusion of ultrasound & X-ray data for inspection of modern microelectronic packages

 Liverpool John Moores Uni.
Prof D Harvey
          
Harsh environments interconnect

Loughborough Uni.
Prof P Conway

          
Ion implanted Bragg grating filters in silicon

 Uni. of Surrey
Prof G Reed		       Intel Corporation  
CFD Technology development for electro-mechanical systems

Cambridge Uni.
Prof P Tucker

       NCR  
Controlled Thermoplastic Polymer Adhesion to Materials Used in Electronics

 Loughborough Uni.
(Dr P Webb)		          
Dynamic system modeling and performance optimization of a distributed generation power pack

 Uni. of Nottingham
Dr P Zanchetta		          
Micro-interconnections Using Single Crystals

 Loughborough Uni.
Prof C Liu		         click here
Molecular junctions - made to measure

 Uni. of Bath
F Marken		         click here
Non-invasive ‘safety agents’ for embedded processors

 Uni. of Leicester
Dr M Pont		          
Piezo-electric transformers for power electronic applications

 Uni. of Sheffield
Dr M Foster		         click here
Power PC Thermal Management and Performance Modelling

 Greenwich Uni.
Prof N Ekere		       BAE Systems  
The investigation of the use of advanced sensing technologies for protection suits

 Coventry Uni.
Dr E Gaura		       NP Aerospace, BAE Systems click here
Under bump metallization technologies for high sensitivity spectroscopic X-ray detectors Loughborough Uni.
Prof C Liu
      

Science and Technology Facilities Council.  Rutherford Appleton Laboratory (STFC-RAL)

  
TIMERA: Testing & Inverse Modelling for Electronics Reliability analysis Greenwich Uni.
Prof C Bailey		       NPL  
The Development of a Novel Through Hole Metallization process using Conductive Nanoparticles and the Dispersive Properties of Ultrasound Coventry Uni.
Dr L Paniwnyk		          
Costing for through life availability Loughborough Uni.
Dr M Goh		          
   

 

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